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UL · IEC · NEC Certified

Hardware that powers EV infrastructure

EV charging power module — silicon carbide converter with copper bus bars and active cooling

Two-Level Full-Bridge LLC Converters. Three-Phase Vienna Rectifiers. OCPP 2.0.1 · ISO 15118-2 · IsoMOV SPD — production-deployed, certification-proven.

LLC ResonantVienna RectifierOCPP 2.0.1ISO 15118-2240kW DCFCIsoMOV SPDUL · IEC · CE
UL 2202IEC 61851NEC NFPA 70CE MarkingOCPP 2.0.1ISO 15118-2ARAIIsoMOV SPDVienna RectifierLLC ResonantCCS · CHAdeMO · Type-2UL 2202IEC 61851NEC NFPA 70CE MarkingOCPP 2.0.1ISO 15118-2ARAIIsoMOV SPDVienna RectifierLLC ResonantCCS · CHAdeMO · Type-2

8+

Years Exp

80+

DCFC Units

240kW

Max Output

6+

Certifications

Charger Telemetry

DC Output Power

240 kW

Grid Voltage

400 V

Charging Efficiency

97.3%

Thermal Margin

12°C

SYSTEM LOG // REALTIME

[OK]OCPP 2.0.1 handshake complete
[OK]ISO 15118-2 PnC authenticated
[WARN]Grid frequency deviation +0.3 Hz
[OK]CCS2 interlock engaged
0+
DCFC Units Deployed
0+
Years Design Experience
0
Certifications Executed
0kW
Max Power Track Record

Engineering Services

Five Core Disciplines

From architecture to certification — every phase of hardware development.

EV Charging Infrastructure Design

End-to-end architecture for AC wallboxes to 240kW DC fast chargers. Two-Level Full-Bridge LLC and Three-Phase Vienna Rectifier topologies. Connector interfaces: CCS, CHAdeMO, Type-2, GB/T.

LLC ResonantVienna RectifierCCS / CHAdeMOISO 15118-2OCPP 2.0.1
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Technical Consulting & Advisory

Expert advisory across power electronics, embedded systems, thermal engineering, and product architecture. From requirements specification to system rule validation.

Power ElectronicsThermal EngineeringSystem ArchitectureRequirements Spec
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Integrated ECAD/MCAD Design

High-speed multi-layer PCB design with impedance matching, layer stack-up definitions, signal integrity constraints, and mechanical tolerance engineering.

Multi-layer PCBSignal IntegrityImpedance MatchingThermal Design
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NPI & Project Consultancy

Full lifecycle project execution from architecture and schematic capture to prototyping, regulatory validation, and commercialization. CE, ARAI, UL, IEC standards.

NPI LifecycleUL / IEC / CEARAIPrototype to Production
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Innovative Tech Integration

OCPP 2.0.1 implementation telemetry, ISO 15118 plug-and-charge communication controllers, grid balancing automation, and custom embedded firmware stacks.

OCPP 2.0.1ISO 15118Grid BalancingEmbedded Firmware
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Why HayimHardy

Built Different. Proven in Production.

01

Production-Proven Topologies

80+ DCFC units in US commercial operations. Two-Level Full-Bridge LLC and Three-Phase Vienna Rectifier — not textbook designs.

02

Full-Spectrum Compliance

6 UL/IEC/NEC certifications executed. OCPP 2.0.1 and ISO 15118-2 with deep understanding of regulatory boundary conditions.

03

BOM Cost Engineering

15% production BOM cost reduction on active projects. 30% throughput improvement through design-for-manufacture optimization.

04

Global Manufacturing Standards

Bengaluru-based precision with US-market deployment track record. ARAI, CE, and global compliance built in from day one.

Selected Work

Engineering at Scale

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DC Fast ChargingDEPLOYED

240kW Multi-Standard DCFC Architecture

80+ Units · US Commercial Deployment

Full hardware architecture for dual-output DC fast chargers. Two-Level Full-Bridge LLC topology with IsoMOV-based SPD design and SuperCap backup via LTC3350.

LLCOCPP 2.0.1UL Listed
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Embedded IoTCOMPLETED

Industrial IoT Hardware Platform

Multi-site Deployment · India

Custom embedded hardware platform for industrial IoT data acquisition. Multi-protocol connectivity, edge compute capability, −40°C to 85°C operating range.

EmbeddedESP32PCB Design
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Edge ComputingCOMPLETED

PCIe 3.0 Edge Computing Module

Delivered · Production Ready

Custom edge computing hardware with PCIe 3.0 interface. High-speed signal integrity design, thermal management, compliance testing.

PCIe 3.0SI/PIEdge AI
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Technical Insights

Thought Leadership from the Field

Deep technical articles on power electronics, EV charging architecture, and embedded systems engineering.

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Power Electronics· Jan 2025

LLC vs Vienna Rectifier: Architecture Selection for High-Power DCFC

A technical breakdown of topology selection criteria for DC fast chargers above 60kW — efficiency curves, component stress, and thermal implications.

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Standards & Compliance· Feb 2025

OCPP 2.0.1: What Changes at the Hardware Interface Level

Protocol changes between OCPP 1.6 and 2.0.1 that affect PCB layout, communication ICs, and firmware architecture decisions.

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Start a Project

Ready to Architect Your Next Hardware Platform?

From power topology selection to regulatory submission — eight years of production-proven hardware expertise.

Based in Bengaluru, IndiaIndia & International ProjectsConfidential Engagements

CAPABILITY OVERVIEW

See Our Full Engineering Capability

A concise document covering our five engineering disciplines, key power topologies, certification experience (UL · IEC · CE · ARAI), and team credentials — useful for procurement and technical evaluation.

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