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◆ CHARTER OBJECT 03
🔧Integrated ECAD/MCAD Design
High-speed multi-layer PCB design with impedance matching, layer stack-up definitions, signal integrity constraints, and mechanical tolerance engineering.
◆ TECHNICAL SPECIFICATIONS
| Parameter | Specification |
|---|---|
| Layer Count | 2 to 16+ layer PCB designs |
| Impedance Control | Single-ended 50Ω · Differential 100Ω · Microstrip / Stripline |
| Signal Speed | Up to 10 Gbps (PCIe 3.0 verified) |
| Thermal Design | Copper pours · Thermal vias · Heatsink simulation |
| Design Tools | Altium Designer · KiCad · SolidWorks |
| File Deliverables | Gerbers · BOM · Assembly drawings · 3D STEP |
| Compliance | IPC-2221 · IPC-7351 · IPC-6012 |
◆ ENGAGEMENT PROCESS
STEP 01
Requirements Capture
Topology selection, power specification, compliance targets, and project scope definition.
STEP 02
Architecture Design
Full schematic capture, BOM development, thermal analysis, and design rule review.
STEP 03
Prototype & Validate
PCB build, functional testing, safety validation, and iteration against spec.
STEP 04
Certification & NPI
Regulatory submission preparation, agency liaison, and production handoff documentation.
◆ START A PROJECT
Scope Your Integrated ECAD/MCAD Design Engagement
Bring in eight years of production-proven hardware expertise — from first topology decision to regulatory sign-off.